DPA Showcasing Subminiature Microphones At WFX
New d:screet 6060/61 lavalier and d:fine 6066 headset microphones with CORE by DPA technology to be presented at the CCI Solutions booth.
New d:screet 6060/61 lavalier and d:fine 6066 headset microphones with CORE by DPA technology to be presented at the CCI Solutions booth.
Events in Washington, DC and Charlotte, NC to demonstrate best practices on miking drums, vocals, and more with top microphone techniques.
New 3 millimeter d:screet CORE 6060 and 6061 and d:fine CORE 6066 headset microphones incorporate recently launched CORE by DPA technology.
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